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| TLBD1050(T20),TLEGD1050(T20) TOSHIBA LED Lamp sdmsshud TLBD1050(T20),TLEGD1050(T20) unit*F mm * Panel Circuit Indicator * * * * * 5.2 (L) x 5.2 (W) x 4.0 (H) mm size O 3.6mmtransparent lens top type Colors : BlueE 470 nm (typ.) d** : GreenE 528 nm (typ.) d** Clear luminescence is obtained. High Operating Temperature : Topr = - 40~100C(85*Z ) : Tstg=*| 40~110*Z * * * * Can be mounted using surface mounter. Reflow Soldering is possible. Standard Embossed Taping 8 mm pitch : T20(400pcs/Reel) Applications : message signboards, backlighting, amusement, etc Color and Material Product Name TLBD1050 TLEGD1050 Color Blue Green Material InGaN InGaN JEDEC JEITA TOSHIBA Weight: O*D OWTg S *|T t P 1 2007-5-17 TLBD1050(T20),TLEGD1050(T20) Maximum Ratings (Ta = 25C) Product Name TLBD1050 TLEGD1050 Forward Current IF(mA) 30 30 Reverse Voltage VR(V) 4 4 Power Dissipation PD(mW) 120 120 Operating Temperature Topr(*Z ) -40~85 -40~100 Storage Temperature Tstg(*Z ) -40~110 -40~110 IF - Ta 35 (mA) 30 skac POTO IF 25 Allowable forward current 20 15 skdfc POTO 10 5 0 0 20 40 60 80 100 120 Ambient temperature Ta (C) Electrical Characteristics (Ta = 25C) Product Name TLBD1050 TLEGD1050 Forward Voltage Min. 2.7 2.7 Typ. 3.3 3.3 Max 4.0 4.0 VF IF 20 Reverse Current IR Max. VR 10 4 Unit V mA A V 2 2007-5-17 TLBD1050(T20),TLEGD1050(T20) Optical Characteristics-1 (Ta = 25C) Product Name TLBD1050 TLEGD1050 Unit Luminous Intensity IV Min 153 476 Typ 400 1300 Max IF 20 20 Corresponding brightness rank sign*iNote 1*j *| *| mcd mcd mcd mA Note 1: The brightness rank classification executes based on the following rank table, and is classified by the reel. However, the delivery ratio of each classification is not defined. Optical Characteristics-2 (Ta = 25C) Emission Spectrum Product Name Peak Emission Wavelength p Min Typ Max 468 518 nm Typ 25 35 nm Dominant Wavelength d Min 463 518 Typ 470 528 nm Max 479 540 mA 20 IF TLBD1050 TLEGD1050 Unit * * Note 2: Caution ESD withstand voltage according to MIL STD 883D, Method 3015.7 : =1000V When handling this LED, take the following measures to prevent the LED from being damaged or otherwise adversely affected. 1) Use a conductive tablemat and conductive floor mat, and ground the workbench and floor. 2) Operators handling laser diodes must be grounded via a high resistance (about 1MO). A conductive strap is good for this purpose. 3) Ground all tools including soldering irons. * This product is designed as general display light source usage, and it has applied the measurement standard that matched with the sensitivity of human's eyes. Therefore, it is not intended for usage of functional application (ex. Light source for sensor , optical communication and etc) . 3 2007-5-17 TLBD1050(T20),TLEGD1050(T20) TLBD1050 IF - VF 100 Ta = 25C 1000 Ta = 25C IV - IF 30 IV (mcd) Luminous intensity 2.6 3.0 3.4 3.8 4.2 4.6 5.0 500 300 Forward current IF (mA) 10 100 50 30 3 1 2.2 10 1 3 5 10 30 50 100 Forward voltage VF (V) Forward current IF (mA) 10 IV - Tc 1.0 Relative luminous intensity - wavelength Ta = 25C Relative luminous intensity I V 5 3 Relative luminous intensity -20 0 20 40 60 80 100 0.8 0.6 1 0.5 0.3 0.4 0.2 0.1 1 300 400 500 600 700 Case temperature Tc (C) Wavelength (nm) Radiation pattern Ta = 25C 4 2007-5-17 TLBD1050(T20),TLEGD1050(T20) TLEGD1050 IF - VF 100 10000 Ta = 25C Ta = 25C IV - IF IV (mcd) Luminous intensity 5000 3000 (mA) Forward current IF 30 10 1000 500 300 3 1 2.2 2.6 3.0 3.4 3.8 4.2 5.0 100 1 3 5 10 30 50 100 Forward voltage VF (V) Forward current IF (mA) IV - Tc 10 1.0 Relative luminous intensity - wavelength Ta = 25C 0.8 Relative luminous intensity I V 5 3 Relative luminous intensity 0.6 1 0.4 0.5 0.3 0.2 0.1 -20 0 20 40 60 80 100 1 300 400 500 600 700 Case temperature Tc (C) Wavelength (nm) Radiation pattern Ta = 25C 5 2007-5-17 TLBD1050(T20),TLEGD1050(T20) Packaging These LED devices are packed in an aluminum envelope with silica gel and a moisture indicator to prevent moisture absorption. The optical characteristics of the devices may be affected by exposure to moisture in the air before soldering and they should therefore be stored under the following conditions: 1. This moisture-proof bag may be stored unopened for up to 12 months under the following conditions. Temperature: 5C~30C Humidity: 90% (max) 2. After the moisture-proof bag has been opened, the devices should be assembled within 72 hours in an environment of 5C to 30C/70% RH or below. 3. If, upon opening, the moisture indicator card shows humidity of 30% or above (when the indication color changes to pink) or the expiration date has passed, the devices should be baked while packed in the tape reel. After baking, use the baked devices within 72 hours, but perform baking only once. Baking conditions: 60 5C, for 12 to 24 hours. Expiration date: 12 months from the sealing date, which is imprinted on the same side as this label. 4. Repeated baking may cause the peeling strength of the tape to change, leading to trouble in mounting. Also, be sure to prevent damage to the device from static electricity during the baking process. 5. Any breakage in the laminate packing material will cause the hermetically of the product to deteriorate. Do not toss or drop the packed devices. Mounting Method Soldering * Reflow soldering (example) Temperature profile for Pb soldering (example) 10 s max (*) 240C max Package surface temperature (C) Temperature profile for Pb-free soldering (example) 5 s max (*) (*) Package surface temperature (C) (*) 4C/s max (*) max(*) 230C 150~180C 260C max (*) 140~160C max(*) 4C/s max(*) 60~120 s max(*) 4C/s max (*) 4C/s max max(*) 60~120 s 30~50s max(*) Time (s) Time (s) * The product is evaluated using above reflow soldering conditions. No additional test is performed exceed the condition (i.e. the condition more than (*)MAX values) as a evaluation. Please perform reflow soldering under the above conditions. Perform the first reflow soldering in accordance with the above temperature profile and within 72 hours of opening the package. Second time reflow In case of second reflow soldering should be performed within 72 hours of the first reflow under the above conditions. Storage conditions before the second reflow soldering: 5*30C, 70% RH max Do not perform flow soldering. Make any necessary soldering corrections manually. (only once at each soldering point) Soldering iron: Less than 25 W Temperature : Less than 350C or less Time : within 3 s (Up to 1time per place) * * * * 6 2007-5-17 TLBD1050(T20),TLEGD1050(T20) Recommended soldering pattern 2.45 1.3 2.45 Unit: mm 2.7 Cleaning When cleaning is required after soldering, Toshiba recommends the following cleaning solvents. Our dipping tests (carried out under the recommended conditions) confirm that these solvents have no effect on semiconductor devices. In selecting the cleaning solvent you will actually use, be sure to take into account the cleaning conditions and usage conditions. Cleaning Solvent ASAHI CLEAN AK-225AES KAO CLEANTHROUGH 750H PINE ALPHA ST-100S TOSHIBA TECHNOCARE (FRW-17, FRW-1, FRV-100) Manufacturer ASAHI GLASS KAO ARAKAWA CHEMICAL GE TOSHIBA SILICONES Precautions When Mounting Do not apply force to plastic parts of the LED under high-temperature conditions. The LED plastic is easily scratched. Avoid friction between plastic parts and hard objects or materials. When installing the PCB in a product, ensure that the device does not come into contact with other components. Tape Specifications This specification lays out the 8 mm pitch embossed-tape packing requirements for 5.2 mm (L) x 5.2 mm (W) x 4.0 mm (H) size surface-mount LED lamp. 1. Product number format The type of package used for shipment is denoted by a symbol suffix after the product number. The method of classification is as below. (This method, however, does not apply to products whose electrical characteristics differ from standard Toshiba specifications.) (1) Tape Type: T20 (8-mm pitch) (2) Example TLBD1050 (T20) Tape type Toshiba product No. 2. Related Matters (1) Electro-optical Characteristics Please refer to the each technical datasheet for electro-optical characteristics of tape packed products. (2) Handling Precautions Tape material protected against static electricity. However, static electricity may occur depending on quantity of charged static electricity and a device may attach to a tape, or a device may be unstable when peeling a tape cover. (a) In process, taping materials may sustain an electrostatic charge, use an ionizer to neutralize the ions. (b) For transport and temporary storage of devices, use containers (boxes, jigs, bags) that are made of anti-static materials or of materials that dissipate electrostatic electricity. 7 2007-5-17 TLBD1050(T20),TLEGD1050(T20) 3. Tape Dimensions Unit in mm Symbol D E P0 t F D1 Dimension 1.5 1.75 4.0 0.4 5.5 1.6 Tolerance +0.1/-0 0.1 0.1 0.05 0.05 0.1 Symbol P2 W P A0 B0 K0 Dimension 2.0 12.0 8.0 5.5 5.5 4.4 Tolerance 0.05 0.2 0.1 0.1 0.1 0.1 P0 D P2 E F W t K0 B0 POLARITY A0 P D1 4. Reel Dimensions Unit in mm 13 0.3 15.4 1.0 180 +0 -4 13 2 0.5 8 60 44 2007-5-17 TLBD1050(T20),TLEGD1050(T20) 5. Leader and Trailer 40 mm or more (Note 1) 40 mm or more (Note 2) Leading part 190 mm (min) Note1: Empty trailer section Note2: Empty leader section 6*D Packing display *iP *jPacking quantity Tape type s QO No. @ A B C D E Reel S OOpcs Carton QOOOpcs Bar-code label Bar-code label D Item Reel Silica gel Indicator Aluminum pack Cushion Carton E @ A comment C B *iQ*jPacking form: Each reel is sealed in an aluminum pack with silica gel. 9 2007-5-17 TLBD1050(T20),TLEGD1050(T20) 7*D Label format *iP*j Example*F ac POTO *is QO*j *j sk *- below for how to decipher the Lot Number. See P/N*F TOSHIBA TYPE TLBD1050 ADDC (T20) Lot. Number & Symbol for control (Rank symbol) Use under 5-30degC/70%RH within 72h **G*n / RoHS COMPATIBLE mn m* *(Y)380* * * * 400 Symbol for control p*e TY 400pcs 400 SEALED May,17,2007 DIFFUSED IN USA ASSEMBLED IN JAPAN *a*a*a*a*a*a*a*a*a*a*a*a*a*a*a*a*a*a*a*a*a*a*a*a*a*a*a*a*a*a*a*a*a*a*a*a*a*a*a*a*a *a*a*a*a*a*a*a*a*a*a*a*a*a*a*a*a*a*a*a*a*a*a*a*a*a*a*a*a*a*a*a*a*a*a*a*a*a *a*a*a *iQ*jLabel location * Reel * Carton Tape reel direction Label position Label position The aluminum package in which the reel is supplied also has a copy of the label attached to the center of one side. *The Lot Number includes the following information. Example: 270 7 E 2 G a a: b: c: d: e: bcde Domestic ID Last digit of the year (CE): "0" (Y2000), "1" (Y2001), "2" (Y2002) ~ "9" (Y2009) Repeated for each decade Month: "A" (Jan), "B" (Feb), "C" (Mar) ~ "L" (Dec) Decade of the month: "1" (First), "2" (Middle), "3" (Last) Day in d above: "A" (1st), "B" (2nd), "C" (3rd) ~ "J" (9th), "K" (10th) "L" denotes the 31st of the month "I" is not used to denote a day in this date system "Packaged May 17, 2007" * 10 2007-5-17 TLBD1050(T20),TLEGD1050(T20) RESTRICTIONS ON PRODUCT USE 030619EAC * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. * TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc.. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. * TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced and sold, under any law and regulations. * GaAs(Gallium Arsenide) is used in this product. The dust or vapor is harmful to the human body. Do not break, cut, crush or dissolve chemically. 11 2007-5-17 |
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